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Renesas offers a variety of easy-to-use boards for evaluation of MCU and MPU products targeted at kick starting your development project.
Product ID | Title | Type | Company |
---|---|---|---|
RZ/G2M-HiHope | RZ/G2M Reference Board | Reference | Jiangsu HopeRun Software Co., Ltd. (HopeRun) |
RZ/G2N-HiHope | Musashi (RZ/G2N) Reference Board | Reference | Jiangsu HopeRun Software Co., Ltd. (HopeRun) |
RZ/G2H-HiHope | RZ/G2H Reference Board | Reference | Jiangsu HopeRun Software Co., Ltd. (HopeRun) |
GR-MANGO | Gadget Renesas Board for the RZ/A2M MPUs | Evaluation | Core |
GR-LYCHEE | GR-LYCHEE | Evaluation | Core |
GR-PEACH | GR-PEACH | Evaluation | Core |
TS-CG-RL78I1A-102KIT | RL78/I1A Lighting Communication Control Gear Evaluation Board | Evaluation | TESSERA Technology Inc. |
TS-EC-1 | Remote I/O Solution for EC-1 | Evaluation | TESSERA Technology Inc. |
EK874 | RZ/G2E Reference Board | Reference | Silicon Linux |
SEMB1320 | CPU Card With R-IN32M3 Module - Solution Kit for R-IN32M3 Module | Starter | Shimafuji Electric Incorporated |
SBEV-RCAR-KF-M06 | Kingfisher | Starter | Shimafuji Electric Incorporated |
SBEV-RCAR-CCPF-SK | CCPF-SK (Connected Car Platform Evaluation Board) | Starter | Shimafuji Electric Incorporated |
TS-CG-RL78I1A-102KIT | RL78/I1A Lighting Communication Control Gear Evaluation Board | Evaluation | TESSERA Technology Inc. |
TS-EC-1 | Remote I/O Solution for EC-1 | Evaluation | TESSERA Technology Inc. |
SESUB-PAN-DA14580 | TDK Bluetooth® Low Energy Module | Development | TDK Corporation |
SESUB-PAN-DA14580 | TDK Bluetooth® Low Energy Module | Development | TDK Corporation |
HJ-DA16200 | DA16200 Hongjia HJ-DA16200 Wi-Fi SIP Module | Development | Tangshan HongJia Electronic Technology Co., Ltd |
HJ-131IMH | DA14531 Hongjia HJ-131IMH Ultra-Small, Ultra-Low Power Bluetooth 5.1 SIP Module | Development | Tangshan HongJia Electronic Technology Co., Ltd |
HJ-580CY | DA14580 HongJia HJ-580CY Bluetooth® Low Energy 4.2 Module | Development | Tangshan HongJia Electronic Technology Co., Ltd |
HJ-531IMF | DA14531 Hongjia HJ-531IMF Ultra-Small, Ultra-Low Power Bluetooth 5.1 SIP Module | Development | Tangshan HongJia Electronic Technology Co., Ltd |
SPARKFUN-THING-PLUS-DA16200 | SparkFun Thing Plus - DA16200 Features a Highly Integrated Low Power Wi-Fi SoC for Developing Wi-Fi and IoT Solutions | Development | SparkFun Electronics |
SPARKFUN-QWIIC-DA16200 | SparkFun Qwiic Wi-Fi Shield Featuring the Ultra-Low Power DA16200 Wi-Fi Module | Development | SparkFun Electronics |
SPARKFUN-MICROMOD-DA16200 | SparkFun MicroMod WiFi Function Board Featuring the Ultra-Low Power DA16200 Wi-Fi Module | Development | SparkFun Electronics |
SMART-USB-DONGLE | Smart USB Dongle Featuring the SmartBond™ DA14683 Bluetooth® Low Energy 5.0 SoC | Development | Smart Sensor Devices |
EK874 | RZ/G2E Reference Board | Reference | Silicon Linux |
SX-23BT | Silex SX-23BT / SX-23BT-EVK (SX-23BT Evaluation Board) | Evaluation | Silex Technology |
SEMB1320 | CPU Card With R-IN32M3 Module - Solution Kit for R-IN32M3 Module | Starter | Shimafuji Electric Incorporated |
SBEV-RCAR-KF-M06 | Kingfisher | Starter | Shimafuji Electric Incorporated |
SBEV-RCAR-CCPF-SK | CCPF-SK (Connected Car Platform Evaluation Board) | Starter | Shimafuji Electric Incorporated |
PAN1740 | Panasonic Bluetooth® Low Energy Module | Development | Panasonic Corporation of North America |
PAN1740A | Panasonic Bluetooth® 5.0 with Small Size (DA14585) | Development | Panasonic Corporation of North America |
Murata-Type-ZF | Murata Type ZF Bluetooth® Low Energy Module | Development | Murata Manufacturing Co., Ltd. Logo |
Murata-Type-ZY | Murata Type ZY Bluetooth® Low Energy Module | Development | Murata Manufacturing Co., Ltd. Logo |
FTCLICK | MikroBUS™ Compatible Interface Module | Development | MikroElektronika |
MIKROE-4350 | RA4M1 Clicker - RA4M1 MCU Group Compact Starter Board | Starter | MikroElektronika |
LP-WiFi-Click | Ultra-Low Power Wi-Fi Solution Add-On Board Featuring the DA16200 Wi-Fi Module | Development | MikroElektronika |
BLUETOOTH-LE-TINY-CLICK | Mikroe Bluetooth® LE TINY Click™ with SmartBond™ DA14531 Module | Development | MikroElektronika |
EagleCAM | EagleCAM Smart Camera Platform by LUPA | Development | LUPA-Electronics GmbH |
eDVP | eCUBE DVP Development Platform (Camera Board for R-Car V3H Starter Kit) by Lacroix | Development | Lacroix Impulse |
eCUBE | eCUBE Development Platform by Lacroix | Development | Lacroix Impulse |
RZ/G2M-HiHope | RZ/G2M Reference Board | Reference | Jiangsu HopeRun Software Co., Ltd. (HopeRun) |
RZ/G2N-HiHope | Musashi (RZ/G2N) Reference Board | Reference | Jiangsu HopeRun Software Co., Ltd. (HopeRun) |
RZ/G2H-HiHope | RZ/G2H Reference Board | Reference | Jiangsu HopeRun Software Co., Ltd. (HopeRun) |
iW-RainboW-G21D | iWave RZ/G1H-PF Development Kit | Reference | iWave Systems Technologies Pvt. Ltd. |
iW-RainboW-G20D | iWave RZ/G1M-PF Development Kit | Reference | iWave Systems Technologies Pvt. Ltd. |
iW-RainboW-G20D | iWave RZ/G1N-PF Development Kit | Reference | iWave Systems Technologies Pvt. Ltd. |
iW-RainboW-G22D | iWave RZ/G1E-PF Development Kit | Reference | iWave Systems Technologies Pvt. Ltd. |
iW-RainboW-G23S | iWave RZ/G1C-PF Development Kit | Reference | iWave Systems Technologies Pvt. Ltd. |
R-IN32M4-CL3-KickStart-Kit | R-IN32M4-CL3 KickStart Kit From IAR Systems | Starter | IAR Systems |
GR-MANGO | Gadget Renesas Board for the RZ/A2M MPUs | Evaluation | Core |