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Winbond Electronics Corporation DRAM & Flash Solutions
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Overview
Description
Solution Summary
Winbond provides a total memory solution including NOR Flash, NAND Flash and DRAM suitable for the R-Car family that requires external memory.
Features/Benefits
- Serial NOR: Quad / Octal SPI, 2Mb~2Gb, 1.8V and 3.3V, 100K cycles endurance
- Serial NAND: Quad / Octal SPI, 512Mb~4Gb, 1.8V and 3.3V, 100K cycles endurance
- ONFI NAND: ONFI 1.0, 1Gb~8Gb, 1.8V and 3.3V, 100K cycles endurance
- SDRAM: DDR1/2/3/4 64Mb~8Gb, LPDDR2/4/4x 512Mb~8Gb
- HyperRAM™: HyperBus, 32Mb~512Mb, 1.8V
Comparison
Applications
Applications
- Instrument Cluster
- DAS
- V2X
- Telematics
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Videos & Training
Automotive Cluster - Winbond W25M02GV & RH850/D1M2 (Winbond Electronics Corp. Japan)
Winbond Electronics Corp. Japan
Demonstrates the operation of automotive cluster system by the combination of Serial NAND and RH850/D1M2.
A trusted supplier of advanced memory products
From R&D through advanced manufacturing to dedicated customer service, Winbond Electronics Corporation is a total memory solutions provider.
Winbond’s product portfolio consists of specialty DRAM, mobile DRAM, code storage Flash memory, and TrustME®secure Flash memory products. The company serves customers in the communications, consumer electronics, automotive, industrial, and computer peripherals markets, supplying its products directly or via a global network of authorized distributors.
Winbond’s headquarters are in the Central Taiwan Science Park, and it operates wafer fabrication plants in Taichung and Kaohsiung in Taiwan. Subsidiaries in the USA, Japan, Israel, China, Hong Kong and Germany perform marketing operations and provide direct support to customers.
Winbond’s combination of advanced semiconductor technologies developed in-house and close relationships with customers support its position as a trusted supplier of memory products.
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![R-Car-Patner-[Windbond]](/sites/default/files/media/images/R-Car-Winbond-Campany-Information.png)
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